PSE@UMASS Thomas Russell Research Group

Russell Group News Update

05-16-2007

Chip Breakthrough by Directed Self-Assembly Enhancing American Competitiveness

DOE supported research on controlling the structure of thin films of block copolymers and a collaboration between researchers at NSF-supported MRSEC’s at UMASS and UCSB has led to a revolutionary chip breakthrough that promises to be used in every future microelectronic device. Exploiting novel chemistry and physics, nanoporous thin films have been fabricated from self assembling block copolymers in a lithographic process that allows traditional dielectric materials to be replaced by air. This permits chips to run faster and use less energy. This is a significant advance in exploiting nanotechnology and enhances the competitiveness of US companies in this critical industry. According to Dr. John Kelly, IBM's senior vice president of research and development, "To our knowledge, this is the first time anyone has used nanoscale self-assembled materials to build things that machines aren't capable of doing."

Scanning Electron Micrograph of a high performance microprocessor showing nanometer sized air gaps (courtesy IBM).

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